Wiring board and method of manufacturing the same

Details Wiring board and method of manufacturing the same Wiring board and method of manufacturing the same

2009-12-01

2011-11-29

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S521000, C361S767000, C174S557000

Reexamination Certificate

active

08067695

ABSTRACT:
A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure.

REFERENCES:
patent: 6687985 (2004-02-01), Sakamoto et al.
patent: 2003/0015342 (2003-01-01), Sakamoto et al.
patent: 2008/0006942 (2008-01-01), Park et al.
patent: 2008/0090335 (2008-04-01), Morimoto et al.
patent: 2008/0116565 (2008-05-01), Hsu et al.
patent: 2008-16819 (2008-01-01), None

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