Wiring board and method of fabricating tape-like wiring...

Details Wiring board and method of fabricating tape-like wiring... Wiring board and method of fabricating tape-like wiring...

2006-07-25

2006-07-25

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S260000, C174S261000

Reexamination Certificate

active

07081590

ABSTRACT:
A substrate supporting a plurality of interconnecting patterns arranged in matrix is cut at a position at least between adjacent columns of the interconnecting patterns. A plurality of positioning marks are formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns. Cutting of the substrate is performed by using the positioning marks as reference.

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patent: 2003/0017653 (2003-01-01), Yoshino et al.
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patent: 11-186439 (1999-07-01), None
patent: 2001-0000254 (2001-01-01), None
patent: 00/07235 (2000-02-01), None

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