Wiring board and method for producing the same

Details Wiring board and method for producing the same Wiring board and method for producing the same

2006-11-10

2008-10-28

Dinh, Phuong K (Department: 2839)

Electrical connectors

Including or for use with tape cable

For connection to rigid preformed panel circuit arrangement,...

C361S749000

Reexamination Certificate

active

07442074

ABSTRACT:
A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group. The inner leads (6) of the first group and the inner leads (12) in the dense pitch region of the second group are connected to the feeding bus line on one side of each region, and the inner leads (8) in the sparse pitch region of the second group are connected to the feeding bus line on the other side of each unit region. Non-uniformity of heights of the protruding electrodes due to a difference in the wiring pitches of the inner leads can be suppressed easily.

REFERENCES:
patent: 6320135 (2001-11-01), Saito
patent: 6559524 (2003-05-01), Seko
patent: 7250575 (2007-07-01), Nagao et al.
patent: 7336499 (2008-02-01), Hagiwara
patent: 2003-243455 (2003-08-01), None

Affiliated with

Also associated with

Rating

Wiring board and method for producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring board and method for producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board and method for producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3987880