Wiring board and method for producing same

Details Wiring board and method for producing same Wiring board and method for producing same

2006-02-14

2006-02-14

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S736000, C257S772000, C257S774000, C257S776000, C257S779000, C257S781000, C257S786000, C257S792000, C430S314000

Reexamination Certificate

active

06998713

ABSTRACT:
The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

REFERENCES:
patent: 4835593 (1989-05-01), Arnold et al.
patent: 5285016 (1994-02-01), Narizuka et al.
patent: 5527628 (1996-06-01), Anderson et al.
patent: 5712192 (1998-01-01), Lewis et al.
patent: 5793117 (1998-08-01), Shimada et al.
patent: 5949654 (1999-09-01), Fukuoka
patent: 6268114 (2001-07-01), Wen et al.
patent: 6515372 (2003-02-01), Narizuka et al.
patent: 6756688 (2004-06-01), Narizuka et al.
patent: 042943 (1982-01-01), None
patent: 06-53648 (1994-02-01), None
patent: 07-297321 (1995-11-01), None
patent: 08-45990 (1996-02-01), None
patent: 3027269 (1996-05-01), None
patent: 09-219421 (1997-08-01), None
patent: 09-321084 (1997-12-01), None
patent: 10-092865 (1998-04-01), None
patent: 10-65057 (1998-06-01), None
patent: 10-284846 (1998-10-01), None
patent: 11-054649 (1999-02-01), None
patent: 11-191571 (1999-07-01), None
patent: 11-354560 (1999-12-01), None
patent: WO96/09645 (1996-06-01), None
patent: WO 98/25298 (1998-06-01), None
patent: WO99/23696 (1999-05-01), None

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