Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-27
2008-05-27
Norris, Jeremy C. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S778000, C361S767000, C257S737000, C257S777000, C257S763000, C257S778000
Reexamination Certificate
active
11466843
ABSTRACT:
A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.
REFERENCES:
patent: 5397864 (1995-03-01), Rai et al.
patent: 5955704 (1999-09-01), Jones et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6175152 (2001-01-01), Toyoda
patent: 6208546 (2001-03-01), Ikeda
patent: 6225816 (2001-05-01), Draving et al.
patent: 6858920 (2005-02-01), Hatauchi
patent: 6873058 (2005-03-01), Kobayashi
patent: 6994563 (2006-02-01), Amini et al.
patent: 7049687 (2006-05-01), Takahashi et al.
patent: 7087844 (2006-08-01), Ishimaru et al.
patent: 7301103 (2007-11-01), Tanaka et al.
patent: 2002/0172024 (2002-11-01), Hui et al.
patent: 2004/0212969 (2004-10-01), Imamura et al.
patent: 2004-327936 (2004-11-01), None
Imamura Hiroyuki
Shimoishizaka Nozomi
Hamre Schumann Mueller & Larson P.C.
Matsushita Electric - Industrial Co., Ltd.
Nguyen Hoa C
Norris Jeremy C.
LandOfFree
Wiring board and method for manufacturing the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wiring board and method for manufacturing the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board and method for manufacturing the same, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3935295