Wiring board and method for fabricating the same

Details Wiring board and method for fabricating the same Wiring board and method for fabricating the same

2008-09-02

2008-09-02

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000

Reexamination Certificate

active

11812124

ABSTRACT:
The wiring board comprises a plate-shaped conductive core material10with a through-hole12formed in, an insulation layer14formed on the surface of the conductive core material10and on the inside wall of the through-hole12, a resin18buried in the through-hole12with the insulation layer14formed in, wirings22a, 22bformed on the upper surface and the undersurface of the conductive core material10with the insulation layer14formed on, and an wiring22dformed in the through-hole20formed in the resin18and electrically connected to the wirings22a, 22b.

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patent: 2005/0247482 (2005-11-01), Nakamura
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patent: 2002-084072 (2002-03-01), None
patent: 2002-100869 (2002-04-01), None

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