Wiring board and method for fabricating the same

Details Wiring board and method for fabricating the same Wiring board and method for fabricating the same

2007-07-24

2007-07-24

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000

Reexamination Certificate

active

11138467

ABSTRACT:
The wiring board comprises a plate-shaped conductive core material10with a through-hole12formed in, an insulation layer14formed on the surface of the conductive core material10and on the inside wall of the through-hole12,a resin18buried in the through-hole 12 with the insulation layer14formed in, wirings22a, 22bformed on the upper surface and the undersurface of the conductive core material10with the insulation layer14formed on, and an wiring22dformed in the through-hole20formed in the resin18and electrically connected to the wirings22a, 22b.

REFERENCES:
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 6165629 (2000-12-01), Sachdev et al.
patent: 2005/0247482 (2005-11-01), Nakamura
patent: 2000133942 (2000-05-01), None
patent: 2000236167 (2000-08-01), None
patent: 2002084072 (2002-03-01), None
patent: 2002100869 (2002-04-01), None

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