Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-07-18
2010-02-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S737000, C257S773000, C257S786000, C257S779000, C257SE23020
Reexamination Certificate
active
07656022
ABSTRACT:
A wiring board is provided, where in the case where the wiring board and a piezoelectric element are connected via solder, the strength of connection in the peripheral region of the wiring board can be increased, and it is difficult for a connection defect to occur in the step of connecting the wiring board to the piezoelectric element. In addition, a manufacturing method for this wiring board is provided. The area of attaching portions27bprovided in the peripheral region of an insulating film20is made greater than that of attaching portions27aprovided in the inward region. In addition, the thickness of solder bumps25bwhich are formed by providing solder to attaching portions27bis made substantially the same as the thickness of solder bumps25awhich are formed by providing solder to attaching portions27a.
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Baker & Botts LLP
Brother Kogyo Kabushiki Kaisha
Parekh Nitin
LandOfFree
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