Wiring board and circuit apparatus

Details Wiring board and circuit apparatus Wiring board and circuit apparatus

2006-03-24

2008-11-11

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S792000, C361S794000

Reexamination Certificate

active

07450397

ABSTRACT:
A wiring board in which a line can be made narrower and/or a transmission loss can be reduced is developed. The wiring board includes a first conductor and a second conductor maintained at the same potential, a dielectric material layer provided between the first and second conductors, and a third conductor embedded in the dielectric material layer. In the wiring board, a thickness of the dielectric material layer in a first region located between the third conductor and the first conductor is larger than a thickness of the dielectric material layer in a second region located between the third conductor and the second conductor. Moreover, a cross-sectional shape of the third conductor is trapezoidal in which angles of respective ends of the third conductor on a side closer to the second conductor are obtuse.

REFERENCES:
patent: 5559480 (1996-09-01), Ivanivsky
patent: 6483406 (2002-11-01), Sawa et al.
patent: 7172958 (2007-02-01), Sasaki
patent: 63-160363 (1988-07-01), None
patent: 2002-76644 (1990-11-01), None
patent: 10-242599 (1998-09-01), None
patent: 10-290105 (1998-10-01), None
patent: 2000-183232 (2000-06-01), None
patent: 2003-069239 (2003-03-01), None

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