Wiring board and ceramic chip to be embedded

Details Wiring board and ceramic chip to be embedded Wiring board and ceramic chip to be embedded

2011-06-07

2011-06-07

Richards, N Drew (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23001

Reexamination Certificate

active

07956454

ABSTRACT:
A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main surface face the same way. The ceramic chip includes a plurality of second terminal electrodes comprised of a metallized layer and formed on the chip second main surface so as to protrude therefrom. A projecting portion, disposed on the second main surface side so as to surround a plurality of the second terminal electrodes, is formed on the chip second main surface so as to protrude therefrom.

REFERENCES:
patent: 6370010 (2002-04-01), Kuroda et al.
patent: 6979890 (2005-12-01), Kambe et al.
patent: 2000-261124 (2000-09-01), None
patent: 2001-118746 (2001-04-01), None
patent: 2004-172412 (2004-06-01), None
patent: 2005-039217 (2005-02-01), None
patent: 2005-039243 (2005-02-01), None
Japan Patent Office, Office Action, mailed Dec. 8, 2009, in the corresponding Japan Patent Application No. 2006-161700.

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