Wiring board and capacitor to be built into wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S261000

Reexamination Certificate

active

07973245

ABSTRACT:
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.

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Japan Patent Office, Notification of Reasons for Refusal (Office Action), JP Patent Application No. 2006-191442, Dispatch date: Jul. 13, 2010.
Japan Patent Office, Notification of Reasons for Refusal (Office Action), JP Patent Application No. 2006-033080, Dispatched on Apr. 21, 2011.

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