Wiring board and a semiconductor device using the same

Details Wiring board and a semiconductor device using the same Wiring board and a semiconductor device using the same

2007-02-16

2008-12-09

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C359S238000, C359S248000

Reexamination Certificate

active

07463491

ABSTRACT:
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

REFERENCES:
patent: 6330377 (2001-12-01), Kosemura
patent: 6517257 (2003-02-01), Nishikawa et al.
patent: 6977820 (2005-12-01), Uchida
patent: 7015570 (2006-03-01), Emma et al.
patent: 2002/0048436 (2002-04-01), Nishikawa et al.
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patent: 2002-258117 (2002-09-01), None
patent: 2003-179361 (2003-06-01), None
“Birudoappu taso purinto haisenban gijutsu” (Build-up multilayer printed wiring board technology), pp. 67-83, The Nikkan Kogyo Shimbun, Ltd., 2000.
Notification of Reasons for Refusal issued by the Japanese Patent Office on May 23, 2006, for Japanese Patent Application No. 2003-202491, and English-language translation thereof.

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