Wiring board and a packaging assembly using the same

Details Wiring board and a packaging assembly using the same Wiring board and a packaging assembly using the same

2006-02-07

2006-02-07

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S760000

Reexamination Certificate

active

06995320

ABSTRACT:
A wiring board includes an insulating board defined by a first surface and a second surface opposing to the first surface; first signal strips disposed on the first surface; a first power distribution plane provided on the first surface so as to occupy a residual area of the first signal strips; lands disposed on the second surface; via metals penetrating the insulating board so as to connect the lands to the corresponding first signal strips; a second power distribution plane provided on the second surface.

REFERENCES:
patent: 6198165 (2001-03-01), Yamaji et al.
patent: 6429372 (2002-08-01), Taguchi et al.
patent: 6507100 (2003-01-01), Valluri et al.
patent: 2002/0096357 (2002-07-01), Iwasaki et al.
patent: 2003/0071364 (2003-04-01), Kusakabe et al.

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