Wiring board and a method of manufacturing

Details Wiring board and a method of manufacturing Wiring board and a method of manufacturing

1993-06-18

1994-05-03

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174268, H05K 109

Patent

active

053089278

ABSTRACT:
A wiring board, which can be efficiency produced and has excellent heat resistance, and a method of manufacturing the same. With ion-irradiation, a conductive layer and a metal layer are formed in an insulating substrate. In the vicinity of the interface between the insulating substrate and the metal layer, a composition region, which includes the atoms of the insulating substrate and the metal layer, is formed by applying ions to a metal layer formed in the insulating substrate.

REFERENCES:
patent: 4424095 (1984-01-01), Frisch et al.

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