Wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S736000

Reexamination Certificate

active

07067918

ABSTRACT:
A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.

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Ning-Cheng Lee, “Lead-Free Chip-Scale Soldering of Packages,” Chip Scale Review (Mar.-Apr., 2000), pp. 1-6.
Jennie S. Hwang and Zhenfeng Guo, “Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder,” Chip Scale Review (Jan.-Feb., 2001), pp. 1-5.
Y. M. Chow, W.M. Lau, and Z.S. Karim, “Surface Properties and Solderability Behaviour of Nickel- Phosphorous and Nickel-Boron Deposited by Electroless Plating,” Surf. Interface Anal. vol. 31, (2001) pp. 321-327.
Hisaaki Takao et al.; “Development of Highly Reliable Sn-Ag Lead-Free Solder Alloy”; vol. 35; No. 2; Jun. 2000; pp. 39-46, Abstract.
Masayoshi Date et al.; “Evaluation of Lead-Free Solder Balls Produced By Uniform Droplet Spray Method”; vol. 18; 2002; pp. 43-48, Abstract.

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