Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-06-27
2006-06-27
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S736000
Reexamination Certificate
active
07067918
ABSTRACT:
A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.
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Jennie S. Hwang and Zhenfeng Guo, “Effects of Pb Contamination on the Material Properties of Sn/Ag/Cu Solder,” Chip Scale Review (Jan.-Feb., 2001), pp. 1-5.
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Matsuura Tomonori
Murata Haruhiko
Sato Kazuhisa
NGK Spark Plug Co. Ltd.
Owens Douglas W
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