Wiring board

Details Wiring board Wiring board

1987-05-14

1989-05-30

James, Andrew J.

357 80, 357 81, H01L 2334, H01L 2314, H01L 2340

Patent

active

048355984

ABSTRACT:
A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.

REFERENCES:
patent: 3825803 (1974-07-01), Budde
patent: 3936866 (1976-02-01), Grossman et al.
patent: 4150393 (1979-04-01), Wilson et al.
patent: 4218701 (1980-08-01), Shirasaki
patent: 4222516 (1980-09-01), Badet et al.
patent: 4376287 (1983-03-01), Sochi
patent: 4396936 (1983-08-01), McIver et al.
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4544989 (1985-10-01), Nakabu et al.
patent: 4698662 (1987-10-01), Young et al.
"Microcircuit Heat Sink"-Cherniack et al.-IBM Technical Disclosure Bulletin-vol. 8, No. 10, Mar. 1966., p. 1457.

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