Wiring board

Details Wiring board Wiring board

1988-10-21

1990-05-01

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29846, 174256, H05K 100

Patent

active

049210548

ABSTRACT:
A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has a thermal expansion controller Copper-Invar-Copper core therein with portions of the invar core therein with portions of the Invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the Copper-Invar-Copper core thereby selectively etching portions of the copper and Invar up to the noble metal layer and thereby providing for selectively removing the Invar and replacing it with a laminant material.

REFERENCES:
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4657825 (1987-04-01), Kanda et al.
patent: 4711804 (1987-12-01), Burgess
patent: 4771365 (1988-09-01), Cichocki et al.
patent: 4791248 (1988-12-01), Oldenettel
patent: 4810563 (1989-03-01), DeGree et al.
patent: 4830704 (1989-05-01), Voss et al.
Boccia, L. J.; Constructing PWB's with Copper-Invar-Copper; PC Fab; 7/86; pp. 34-49.
New Board Overcomes TCE Problems; Electronic Packaging & Production; 11/86; pp. 48-50.

Affiliated with

Also associated with

Rating

Wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-824296