Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-08-28
2007-08-28
Smoot, Stephen W. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S701000, C257SE23070, C361S774000
Reexamination Certificate
active
10948075
ABSTRACT:
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is mounted to the wiring base. The electrodes and the wiring pattern face one another and are electrically connected. The wiring base and the semiconductor chip are bonded by curing the resin paste. The wiring pattern includes a wiring that continuously includes two or more first parts located inside a semiconductor chip mounting region and a second part that connects at least two of the first parts. The second part is located outside the semiconductor chip mounting region.
REFERENCES:
patent: 5252853 (1993-10-01), Michii
patent: 6462522 (2002-10-01), Burstein et al.
patent: 6476467 (2002-11-01), Nakamura et al.
patent: 05-082585 (1993-04-01), None
patent: 2000-340934 (2000-12-01), None
patent: 2001-237265 (2001-08-01), None
patent: 2001-284413 (2001-10-01), None
Communication from Japanese Patent Office re: counterpart application, Feb. 2, 2005.
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