Wiring and method of manufacturing the same, and wiring...

Details Wiring and method of manufacturing the same, and wiring... Wiring and method of manufacturing the same, and wiring...

2011-02-08

2011-02-08

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Non-single crystal, or recrystallized, semiconductor...

Field effect device in non-single crystal, or...

C257SE27108

Reexamination Certificate

active

07884369

ABSTRACT:
The wiring of the present invention has a layered structure that includes a first conductive layer (first layer) having a first width and made of one or a plurality of kinds of elements selected from W and Mo, or an alloy or compound mainly containing the element, a low-resistant second conductive layer (second layer) having a second width smaller than the first width, and made of an alloy or a compound mainly containing Al, and a third conductive layer (third layer) having a third width smaller than the second width, and made of an alloy or compound mainly containing Ti. With this constitution, the present invention is fully ready for enlargement of a pixel portion. At least edges of the second conductive layer have a taper-shaped cross-section. Because of this shape, satisfactory coverage can be obtained.

REFERENCES:
patent: 5132745 (1992-07-01), Kwasnick et al.
patent: 5153754 (1992-10-01), Whetten
patent: 5187602 (1993-02-01), Ikeda et al.
patent: 5428250 (1995-06-01), Ikeda et al.
patent: 5464500 (1995-11-01), Tsujimura et al.
patent: 5498573 (1996-03-01), Whetten
patent: 5528082 (1996-06-01), Ho et al.
patent: 5539551 (1996-07-01), Nomoto et al.
patent: 5670062 (1997-09-01), Lin et al.
patent: 5747361 (1998-05-01), Ouellet
patent: 5852481 (1998-12-01), Hwang
patent: 5858879 (1999-01-01), Chao et al.
patent: 5912506 (1999-06-01), Colgan et al.
patent: 5994156 (1999-11-01), Voutsas et al.
patent: 6031290 (2000-02-01), Miyazaki et al.
patent: 6144082 (2000-11-01), Yamazaki et al.
patent: 6166396 (2000-12-01), Yamazaki
patent: 6259138 (2001-07-01), Ohtani et al.
patent: 6335290 (2002-01-01), Ishida
patent: 6365917 (2002-04-01), Yamazaki
patent: 6433842 (2002-08-01), Kaneko et al.
patent: 6436850 (2002-08-01), Morales
patent: 6440865 (2002-08-01), Lee
patent: 6448578 (2002-09-01), Shimada et al.
patent: 6475836 (2002-11-01), Suzawa et al.
patent: 6501098 (2002-12-01), Yamazaki
patent: 6515336 (2003-02-01), Suzawa et al.
patent: 6534789 (2003-03-01), Ishida
patent: 6657260 (2003-12-01), Yamazaki et al.
patent: 6825488 (2004-11-01), Yamazaki et al.
patent: 6900460 (2005-05-01), Yamazaki et al.
patent: 6909114 (2005-06-01), Yamazaki
patent: 6949767 (2005-09-01), Yamazaki
patent: 6953951 (2005-10-01), Yamazaki et al.
patent: 6984550 (2006-01-01), Yamazaki et al.
patent: 7023021 (2006-04-01), Yamazaki et al.
patent: 7084019 (2006-08-01), Yamazaki et al.
patent: 2001/0025960 (2001-10-01), Ohtani et al.
patent: 2001/0030322 (2001-10-01), Yamazaki et al.
patent: 2001/0049197 (2001-12-01), Yamazaki et al.
patent: 2001/0052950 (2001-12-01), Yamazaki et al.
patent: 2001/0055841 (2001-12-01), Yamazaki et al.
patent: 2002/0006705 (2002-01-01), Suzawa et al.
patent: 2002/0013022 (2002-01-01), Yamazaki et al.
patent: 2002/0016028 (2002-02-01), Arao et al.
patent: 2002/0017685 (2002-02-01), Kasahara et al.
patent: 2002/0070382 (2002-06-01), Yamazaki et al.
patent: 2002/0110941 (2002-08-01), Yamazaki et al.
patent: 2002/0158288 (2002-10-01), Yamazaki et al.
patent: 2003/0094614 (2003-05-01), Yamazaki et al.
patent: 2003/0122132 (2003-07-01), Yamazaki
patent: 2005/0056934 (2005-03-01), Suzawa et al.
patent: 2005/0104068 (2005-05-01), Yamazaki
patent: 2005/0110016 (2005-05-01), Yamazaki
patent: 2005/0266593 (2005-12-01), Suzawa et al.
patent: 2006/0091387 (2006-05-01), Yamazaki
patent: 2006/0273317 (2006-12-01), Yamazaki et al.
patent: 1258103 (2000-06-01), None
patent: 1282107 (2001-01-01), None
patent: 0 082 012 (1983-06-01), None
patent: 1 003 223 (2000-05-01), None
patent: 1 005 093 (2000-05-01), None
patent: 1 005 094 (2000-05-01), None
patent: 1 041 641 (2000-10-01), None
patent: 1 045 451 (2000-10-01), None
patent: 1 071 124 (2001-01-01), None
patent: 1071124 (2001-01-01), None
patent: 06-148685 (1994-05-01), None
patent: 07-235680 (1995-09-01), None
patent: 08-274336 (1996-10-01), None
patent: 09-045688 (1997-02-01), None
patent: 11-016913 (1999-01-01), None
patent: 2000-047263 (2000-02-01), None
patent: 2000-223714 (2000-08-01), None
patent: 2001-053283 (2001-02-01), None
patent: 2001-085700 (2001-03-01), None
patent: 2001-144297 (2001-05-01), None
patent: 165416 (1999-02-01), None
patent: 1999-0061336 (1999-07-01), None
patent: 2000-015639 (2000-03-01), None
patent: 2000-063024 (2000-10-01), None
Silicon Processing for VLSI Era, vol. 1, S.Wolf and R.N. Tauber, 1986, p. 518.
Search Report and Written Opinion, Application No. 200201417-3, Intellectual Property Office of Singapore, May 7, 2004.
Search Report, Australian Patent Office, Application No. SG200200805-0, Feb. 16, 2004.
Wolf et al., Silicon Processing for the VLSI Era, 1986, vol. 1—Process Technology, p. 518.
Office Action (Application No. 2007-0029975) dated Jan. 28, 2008.
Office Action (Application No. 2007-0029977) dated Jan. 28, 2008.
Office Action (Application No. 2007-0029977; KR 5628 D2) dated Aug. 21, 2008 with English translation.
Office Action (Application No. 2007-10085019.0) dated Jan. 16, 2009 with English translation.
Office Action (Application No. 2009-0022565) Dated May 18, 2009.

Affiliated with

Also associated with

Rating

Wiring and method of manufacturing the same, and wiring... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wiring and method of manufacturing the same, and wiring..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wiring and method of manufacturing the same, and wiring... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2640008