Wireless IC interconnection method and system

Telecommunications – Transmitter and receiver at separate stations – Near field

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C455S041200, C455S066100

Reexamination Certificate

active

06856788

ABSTRACT:
A wireless IC interconnect system and method facilitates interconnections between first and second IC locations via a wireless transmission medium; the IC locations may be on the same chip or on separate chips. A signal to be conveyed is modulated, and the modulated signal is capacitively coupled to the wireless transmission medium—preferably a properly terminated microstrip transmission line (MTL) or a coplanar waveguide (CPW). The modulated signal is capacitively coupled from the wireless medium to a receiver which demodulates the modulated signal and provides the demodulated signal to the second IC location. In a preferred embodiment, the wireless transmission system conveys numerous signals simultaneously, with the signals modulated and demodulated with multiple access algorithms such as code-division (CDMA) and/or frequency-division (FDMA) multiple access algorithms. The interconnection system can be made reconfigurable, with the destinations of the modulated signals changed by reprogramming associated address codes.

REFERENCES:
patent: 4763340 (1988-08-01), Yoneda et al.
patent: 5621913 (1997-04-01), Tuttle et al.
patent: 6006112 (1999-12-01), Rucki et al.
patent: 6542050 (2003-04-01), Arai et al.
patent: 6542720 (2003-04-01), Tandy
patent: 6546044 (2003-04-01), Dent
patent: 6646525 (2003-11-01), Bozler et al.
patent: 20020051435 (2002-05-01), Giallorenzi et al.
Andrew J. Viterbi,Principles of Spread Spectrum Communication, CDMA, Addison Wesley Longman, Inc. (1995), pp. 1-9.
Behzad Razavi,RF MICROELECTONICS, Prentice Hall PTR (1998), pp. 105-111.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wireless IC interconnection method and system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wireless IC interconnection method and system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wireless IC interconnection method and system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3506142

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.