Wireless electrical connections of abutting tiled arrays

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174254, 29843, H05K 100

Patent

active

051966522

ABSTRACT:
A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12). These bridges (16) are designed to transmit or receive visual, acoustical or other electromagnetic data and power. The conductive bridges (16) are formed to be nearly coplanar with the planar elements (12) and are made to connect the edges (14b) of pads (14) which are fused to the planar substrate (12). Metal wire (16a), solder (16b-c), a conductive polymer (16d), or a suspension of conductive particles in paste (16e) are used to bridge and electrically connect the pads (14) located on the array elements (12). The bridges (16) have a low profile, occupy a very small area and reduce the need for highly accurate alignment of adjacent substrates (12) within the tiled array (10) before electrical connections are formed. These low profile bridges (16) are especially advantageous in that they allow a protective plastic or similar cover sheet, or a liquid crystal laminate to be surface mounted on the composite array (10) without causing detrimental surface blemishes or ridges. The small area of the bridges (16) greatly reduces the non-transmitting area of the visual display. The bridges (16), being substantially narrower than the pads (14) which they connect, are more likely to connect the intended pads (14) and less likely to "short" pads (14) which are not in accurate alignment.

REFERENCES:
patent: 2756485 (1956-07-01), Abramson et al.
patent: 3201851 (1965-08-01), Stearns
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4191789 (1980-03-01), Brown
patent: 4289846 (1981-09-01), Parks et al.
patent: 4628406 (1986-12-01), Smith et al.
patent: 4633035 (1986-12-01), McMonagle
patent: 4712161 (1987-12-01), Pryor et al.
patent: 4787853 (1989-11-01), Igarashi

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