Wireless coupling of staked dies within system in package

Details Wireless coupling of staked dies within system in package Wireless coupling of staked dies within system in package

2005-10-11

2005-10-11

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S686000, C257S687000, C257S777000

Reexamination Certificate

active

06953994

ABSTRACT:
A multi-chip module (MCM) includes a plurality of semiconductor dies within a single package. RF transceivers on two or more of the dies provide inter-chip communications between the dies permitting the establishment of communications without requiring that hardwire connections be established for each signal connection.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6207474 (2001-03-01), King et al.
patent: 6376909 (2002-04-01), Forbes et al.
patent: 6682955 (2004-01-01), Cobbley et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2004/0084766 (2004-05-01), Shieh et al.
patent: 2004/0104462 (2004-06-01), Tao et al.
patent: 2004/0155327 (2004-08-01), Cobbley et al.
Gahagan et al., “RF (Gigahertz) ATE Production Testing On-Wafer: Options and Tradeoffs,” IEEE, 1999 International Test Conference.
Stoukatch et al., “High Density 3-D Stack Structure for Sip Solutions,” IMEC, Kapeldreef 75, 3001 Leuven, Belguim, Internet: http://www.imec.be.
Simon et al., “Interconnects and Transitions in Multilayer LTCC Multichip Modules for 24 GHz ISM-Band Applications,” IEEE International Microwave Symposium (IMS-2000), Jun. 2000, pp. 1047-1050.

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