Wireless communication module

Details Wireless communication module Wireless communication module

2008-03-03

2009-06-30

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S773000, C257S774000, C257S723000, C257S704000

Reexamination Certificate

active

07554189

ABSTRACT:
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.

REFERENCES:
patent: 5811799 (1998-09-01), Wu
patent: 6383835 (2002-05-01), Hata et al.
patent: 6388264 (2002-05-01), Pace
patent: 6534726 (2003-03-01), Okada et al.
patent: 6649834 (2003-11-01), Hsieh et al.
patent: 6862190 (2005-03-01), Olzak et al.

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