Wireless communication medium and method of manufacturing...

Details Wireless communication medium and method of manufacturing... Wireless communication medium and method of manufacturing...

2006-11-28

2006-11-28

Lindsay, Jr., Walter L. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S115000

Reexamination Certificate

active

07141451

ABSTRACT:
A highly reliable inexpensive RFID medium (Radio-frequency Identification medium) and a method of manufacturing the same is provided, particularly for small, thin RFID mediums.A RFID medium includes a transmitting/receiving antenna2and an IC chip3.A rectangular part of a base sheet1,having a major surface on which transmitting/receiving antennas2are formed, is folded along one of the long sides thereof, and the other three sides are bonded to the base sheet1so as to cover the transmitting/receiving antenna2and the IC chip3connected to the transmitting/receiving antenna2.The base sheet1has spacing parts of a predetermined shape for covering the transmitting/receiving antenna2and the IC chip3connected to the transmitting/receiving antenna2.The transmitting/receiving antennas2and the spacing parts22are arranged alternately. The base sheet1is rolled in a roll.

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