Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-09-29
1997-07-15
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361707, 361775, 439 65, H05K 720
Patent
active
056488920
ABSTRACT:
A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM.TM. interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.
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Babinski Thomas E.
Mather John C.
McLaughlin Steven R.
Wieloch Christopher J.
Woychik Gerard A.
Allen-Bradley Company Inc.
Horn John J.
Miller John M.
Tolin Gerald P.
Ziebert Joseph N.
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