Wirefilm bonding for electronic component interconnection

Details Wirefilm bonding for electronic component interconnection Wirefilm bonding for electronic component interconnection

2005-02-22

2005-02-22

Crispino, Richard (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C428S209000, C428S914000, C428S202000, C428S201000, C428S200000, C428S195100

Reexamination Certificate

active

06857459

ABSTRACT:
A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (10) and the second component (12) that advances from a first position (50) to a second position (52). A film tape carrier (32) advances a wirefilm (20) removably coupled to the film tape carrier (32) into the first position (50). The wirefilm (20) includes a substantially planar film (22) and multiple wire strands (14), each wire strand (14) having a first end (24) that contacts a first bonding site (16) and a second end (26) that contacts a second bonding site (18). A film attach tool (62) contacts the first component (10) and the second component (12) with the wirefilm (20) at the first position (50) to interconnect the first component (10) and the second component (12).

REFERENCES:
patent: 3655496 (1972-04-01), Ettre et al.
patent: 3724068 (1973-04-01), Galli
patent: 4650545 (1987-03-01), Laakso et al.
patent: 4857671 (1989-08-01), Nakano et al.
patent: 5530282 (1996-06-01), Tsuji
patent: 5554885 (1996-09-01), Yamasaki et al.
Harper, Charles A, Handbook of Plastics, Elastomers, and Composites, 1992, McGraw-Hill Inc., 2ndEdition, pp. 2.41 to 2.4.

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