Wired circuit forming board, wired circuit board, and thin...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S753000

Reexamination Certificate

active

07417316

ABSTRACT:
A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer2is formed on the insulating base layer1by sputtering the first metal35and the second metal36in such a condition that a first metal diffusing region37for the first metal35to be diffused and a second metal diffusing region38for the second metal36to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion4in which the first metal35is unevenly distributed and which is adjacent to the insulating base layer1, (ii) a second unevenly-distributed metal portion5in which the second metal36is unevenly distributed and which is adjacent to the conductive pattern6, and (iii) a metal coexisting portion3which is interposed between the first unevenly-distributed metal portion4and the second unevenly-distributed metal portion5and in which the first metal35and the second metal36are coexistent with each other in such a relation as to be continuously present in the thin metal layer2without defining any boundaries therebetween.

REFERENCES:
patent: 3881884 (1975-05-01), Cook et al.
patent: 4917963 (1990-04-01), Kittler
patent: 5874174 (1999-02-01), Okuda et al.
patent: 6328858 (2001-12-01), Felsenthal et al.
patent: 6838314 (2005-01-01), Chang
patent: 1 097 234 (1961-01-01), None
patent: 1115911 (1968-06-01), None
patent: 03-082188 (1991-04-01), None
patent: 4-235272 (1992-08-01), None
patent: 6-212410 (1994-08-01), None
patent: 11-92579 (1999-04-01), None
patent: 11-158613 (1999-06-01), None
patent: 2001-73133 (2001-03-01), None
patent: 2003-318533 (2003-11-01), None

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