Wired circuit board with interposed metal thin film and...

Details Wired circuit board with interposed metal thin film and... Wired circuit board with interposed metal thin film and...

2008-03-03

2011-10-04

Thompson, Timothy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C360S245900

Reexamination Certificate

active

08030576

ABSTRACT:
A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.

REFERENCES:
patent: 5858518 (1999-01-01), Omote et al.
patent: 6096482 (2000-08-01), Omote et al.
patent: 6100582 (2000-08-01), Omote et al.
patent: 6198052 (2001-03-01), Omote et al.
patent: 2001/0051707 (2001-12-01), Fukuoka
patent: 2003/0013236 (2003-01-01), Nakata et al.
patent: 2005/0061542 (2005-03-01), Aonuma et al.
patent: 2006/0049516 (2006-03-01), Wang et al.
patent: 1236290 (1999-11-01), None
patent: 1397830 (2003-02-01), None
patent: 03-126291 (1991-05-01), None
patent: 03-268385 (1991-11-01), None
patent: 05-235494 (1993-09-01), None
patent: 10-12983 (1998-01-01), None
patent: 2002-111205 (2002-04-01), None
patent: 2005-100488 (2005-04-01), None

Affiliated with

Also associated with

Rating

Wired circuit board with interposed metal thin film and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wired circuit board with interposed metal thin film and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wired circuit board with interposed metal thin film and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4287118