Wired circuit board having a semiconductive grounding layer...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S254000, C361S753000, C029S825000

Reexamination Certificate

active

08071886

ABSTRACT:
A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.

REFERENCES:
patent: 2003/0151902 (2003-08-01), Kageyama et al.
patent: 2005/0062020 (2005-03-01), Abe
patent: 2006/0187587 (2006-08-01), Arai et al.
patent: 2006/0269730 (2006-11-01), Ishii et al.
patent: 5-331431 (1993-12-01), None
patent: 9-207259 (1997-08-01), None
patent: 11-204919 (1999-07-01), None
patent: 11-284294 (1999-10-01), None
patent: 2002-9203 (2002-01-01), None
patent: 2002-275261 (2002-09-01), None
patent: 2003-124581 (2003-04-01), None
patent: 2003-203436 (2003-07-01), None
patent: 2003-204130 (2003-07-01), None
patent: 2004-35825 (2004-02-01), None
patent: 2004-158480 (2004-06-01), None
patent: 2006-134421 (2006-05-01), None
patent: 2006-332549 (2006-12-01), None

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