Wired circuit board and production method thereof

Details Wired circuit board and production method thereof Wired circuit board and production method thereof

2007-02-13

2008-08-05

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Reexamination Certificate

active

07407386

ABSTRACT:
A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.

REFERENCES:
patent: 2002/0043704 (2002-04-01), Seko
patent: 2005/0001299 (2005-01-01), Ryu et al.
patent: 2005/0218513 (2005-10-01), Seko
patent: 1 691 589 (2006-08-01), None
patent: 2005-175113 (2005-06-01), None

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