Wired circuit board and producing method thereof

Details Wired circuit board and producing method thereof Wired circuit board and producing method thereof

2007-09-12

2011-11-22

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S749000

Reexamination Certificate

active

08063312

ABSTRACT:
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.

REFERENCES:
patent: 2004/0245619 (2004-12-01), Takeuchi et al.
patent: 2004/0252413 (2004-12-01), Nishiyama
patent: 2005/0247481 (2005-11-01), Chen et al.
patent: 02-198186 (1990-08-01), None
patent: 2000-097983 (2000-04-01), None
patent: 2005-11387 (2005-01-01), None
patent: 2006-024878 (2006-01-01), None
patent: 2006-245122 (2006-09-01), None

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