Wired circuit board and producing method thereof

Details Wired circuit board and producing method thereof Wired circuit board and producing method thereof

2011-07-19

2011-07-19

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000, C174S261000

Reexamination Certificate

active

07982136

ABSTRACT:
A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying layer is formed with a corroded portion corroded from a side end portion of the conductive layer toward an inner portion thereof. A semiconductive layer is formed on a surface of the insulating layer and on a surface of the conductive pattern. The semiconductive layer is formed so as to come in contact with the metal supporting board and have a cut formed in the corroded portion to interrupt conduction between the semiconductive layer formed on the surface of the insulating layer and the semiconductive layer formed on a surface of the conductive layer.

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patent: 2004-335700 (2004-11-01), None
patent: 2006-332549 (2006-12-01), None

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