Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-23
2007-10-23
Norris, Jeremy C (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S261000, C361S810000
Reexamination Certificate
active
11135511
ABSTRACT:
A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.
REFERENCES:
patent: 4843191 (1989-06-01), Thomas
patent: 5225633 (1993-07-01), Wigginton
patent: 5321585 (1994-06-01), Trittschuh, III et al.
patent: 5526563 (1996-06-01), Tamaki et al.
patent: 5742484 (1998-04-01), Gillette et al.
patent: 6040529 (2000-03-01), Takeshita et al.
patent: 6118081 (2000-09-01), Faragi et al.
patent: 6239012 (2001-05-01), Kinsman
patent: 6399899 (2002-06-01), Ohkawa et al.
patent: 6469255 (2002-10-01), Watanabe et al.
patent: 6594152 (2003-07-01), Dent
patent: 6603079 (2003-08-01), Biron
patent: 6653575 (2003-11-01), Armezzani et al.
patent: 2002/0009578 (2002-01-01), Watanabe et al.
patent: 2002/0066594 (2002-06-01), Shintani et al.
patent: 2003/0193793 (2003-10-01), Dent
patent: 2004/0050587 (2004-03-01), Tsukashima
patent: 100 56 904 (2002-05-01), None
patent: 2 838 873 (2003-10-01), None
patent: 2001-209918 (2001-08-01), None
patent: 2002-124756 (2002-04-01), None
Akerman & Senterfitt
Edwards, Esq Jean C.
Nitto Denko Corporation
Norris Jeremy C
LandOfFree
Wired circuit board and connection structure of wired... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wired circuit board and connection structure of wired..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wired circuit board and connection structure of wired... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3899901