Wired circuit board

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C174S261000

Reexamination Certificate

active

11365845

ABSTRACT:
A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board1comprises a metal suspension board2, a thin metal film3formed on the metal suspension board2by sputtering or by electrolytic plating, a metal foil4formed on the thin metal film3by electrolytic plating, an insulating base layer5formed on the metal foil4and the metal suspension board2, and a conductive pattern6formed on the insulating base layer5as a wired circuit pattern. The wired circuit board1may include an insulating cover layer7formed on the insulating base layer5to cover the conductive pattern6.

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patent: 2004/0252413 (2004-12-01), Nishiyama
patent: 2005/0122627 (2005-06-01), Kanagawa et al.
patent: 2005/0186332 (2005-08-01), Funada et al.
patent: 2005-11387 (2005-01-01), None

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