Wired circuit board

Details Wired circuit board Wired circuit board

2007-09-18

2007-09-18

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000

Reexamination Certificate

active

11305120

ABSTRACT:
A wired circuit board is provided having excellent heat radiation characteristics, including when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. An insulating base layer defines a base opening portion in a mounting region. The base opening portion includes a thin layer portion that surrounds the base opening portion. Inside terminal portions are disposed on the thin layer portion. A heat radiating portion is formed in the base opening region to contact the stiffener sheet As a result, the surface of the inside terminal portion is located lower in level than the surface of the heat radiating portion. Thus, a semiconductor device may be mounted on the wired circuit board by the flip chip mounting method to enable heat generated from the semiconductor device to be transferred to the stiffener sheet via the heat radiating portion.

REFERENCES:
patent: 5050040 (1991-09-01), Gondusky et al.
patent: 5856911 (1999-01-01), Riley
patent: 6268239 (2001-07-01), Ikeda
patent: 6518518 (2003-02-01), Saiki et al.
patent: 6744135 (2004-06-01), Hasebe et al.
patent: HEI 11-97818 (1999-04-01), None
patent: HEI 11-248032 (1999-10-01), None
patent: 2000-323525 (2000-11-01), None

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