Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2006-06-27
2006-06-27
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S688000, C257S699000, C257S686000, C174S255000
Reexamination Certificate
active
07067912
ABSTRACT:
A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signals. The wired circuit board includes a relay flexible wiring circuit board formed by a first wired circuit board including a first metal substrate, a first insulating base layer, a first conductor layer and a first insulating cover layer which is substantially identical in layer structure with the suspension board with circuit and a second wired circuit board connected with the first wired circuit board for connecting with a control circuit board. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched.
REFERENCES:
patent: 5093761 (1992-03-01), Ozaki
patent: 5592365 (1997-01-01), Sugimoto et al.
patent: 5712749 (1998-01-01), Gustafson
patent: 5961334 (1999-10-01), Inaba
patent: 6388201 (2002-05-01), Yamato et al.
patent: 6797888 (2004-09-01), Ookawa et al.
patent: 2002/0007961 (2002-01-01), Yamato et al.
Ohwaki Yasuhito
Takayoshi Yuichi
Takeuchi Yoshihiko
Akerman & Senterfitt
Edwards, Esq. Jean C.
Flynn Nathan J.
Nitto Denko Corporation
Sandvik Benjamin P.
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