Wired circuit board

Details Wired circuit board Wired circuit board

2006-11-07

2006-11-07

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S258000, C174S260000

Reexamination Certificate

active

07132607

ABSTRACT:
A wired circuit board is provided having enhanced reliability of electrical connection between a metal substrate and a shield layer to achieve significant noise reduction reliably. An insulating base layer is formed on the metal substrate, while resin layers are formed on the metal substrate with a predetermined space provided from the both widthwise sides of the insulating base layer. A conductor layer is formed having a predetermined wired circuit pattern on the insulating base layer. Thereafter, an insulating cover layer is formed on the insulating base layer in such a manner as to cover the conductor layer. Then, a shield layer is laminated on the metal substrate to cover the insulating cover layer and also is put in close contact with the resin layers at end portions thereof by a vacuum film-forming method or by plating.

REFERENCES:
patent: 5857257 (1999-01-01), Inaba
patent: 6399899 (2002-06-01), Ohkawa et al.
patent: 6846991 (2005-01-01), Girard et al.
patent: 2003/0146446 (2003-08-01), Yamazaki et al.
patent: 2005/0061542 (2005-03-01), Aonuma et al.
patent: 2001-044581 (2001-02-01), None
patent: 2003-069170 (2003-03-01), None

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