Wired circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C361S749000

Reexamination Certificate

active

07816609

ABSTRACT:
A wired circuit board is provided having a reinforced part thickened to ensure a high rigidity when it is used, while having the reinforced part thinned for easy handling when it is not yet used to prevent a cost increase and a productivity reduction. When the wired circuit board is used, a folding portion is valley-folded to laminate a reinforcing portion on a second connecting portion to contact the back surface of a fourth reinforcing plate of the reinforcing portion with the back surface of a second reinforcing plate of the second connecting portion. This achieves to reinforce the second connecting portion with the second reinforcing plate and the reinforcing portion and ensure a high rigidity by thickening the reinforced part. Since the reinforcing portion is supported in the same plane as a wired circuit portion via the folding portion before it is used, the reinforced part can be thinned and easy handling is achieved.

REFERENCES:
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 2004/0256147 (2004-12-01), Shigetaka
patent: 58-116262 (1983-08-01), None
patent: 58-225688 (1983-12-01), None
patent: 04-208588 (1992-07-01), None
patent: 5-152693 (1993-06-01), None
patent: H07-170033 (1995-07-01), None
patent: 2001-332818 (2001-11-01), None

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