Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-06-21
2010-06-15
Dinh, Tuan T (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S250000, C174S255000, C174S260000, C174S261000, C361S792000, C361S794000, C361S795000, C257S029000, C257S059000, C257S072000
Reexamination Certificate
active
07737365
ABSTRACT:
A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.
REFERENCES:
patent: 3935333 (1976-01-01), Muneoka et al.
patent: 4109098 (1978-08-01), Olsson et al.
patent: 4289920 (1981-09-01), Hovel
patent: 4719436 (1988-01-01), Garwin et al.
patent: 4823217 (1989-04-01), Kato et al.
patent: 4879620 (1989-11-01), Yamashita
patent: 4901121 (1990-02-01), Gibson et al.
patent: 5039598 (1991-08-01), Abramsohn et al.
patent: 5087517 (1992-02-01), Sagawa et al.
patent: 5340641 (1994-08-01), Xu
patent: 5414576 (1995-05-01), Ueki et al.
patent: 5558977 (1996-09-01), DePalma et al.
patent: 5615078 (1997-03-01), Hudis et al.
patent: 5675470 (1997-10-01), Gong
patent: 5686521 (1997-11-01), Massengale et al.
patent: 5742075 (1998-04-01), Burns et al.
patent: 5781380 (1998-07-01), Berding et al.
patent: 5812349 (1998-09-01), Shouji et al.
patent: 5857257 (1999-01-01), Inaba
patent: 5883759 (1999-03-01), Schulz
patent: 6134084 (2000-10-01), Ohwe et al.
patent: 6198052 (2001-03-01), Omote et al.
patent: 6298212 (2001-10-01), Kono et al.
patent: 6315501 (2001-11-01), Yagai et al.
patent: 6326553 (2001-12-01), Yim et al.
patent: 6341415 (2002-01-01), Amemiya et al.
patent: 6351351 (2002-02-01), Takasugi
patent: 6380493 (2002-04-01), Morita et al.
patent: 6388201 (2002-05-01), Yamato et al.
patent: 6399899 (2002-06-01), Ohkawa et al.
patent: 6479615 (2002-11-01), Fukuoka et al.
patent: 6483123 (2002-11-01), Kim et al.
patent: 6506087 (2003-01-01), Fushimi et al.
patent: 6624046 (2003-09-01), Zavracky et al.
patent: 6650519 (2003-11-01), Karr et al.
patent: 6657688 (2003-12-01), Nagata et al.
patent: 6693735 (2004-02-01), Muray et al.
patent: 6771737 (2004-08-01), Kerslick et al.
patent: 6784471 (2004-08-01), Nakabayashi
patent: 6791742 (2004-09-01), Staker et al.
patent: 6801402 (2004-10-01), Subrahmanyam et al.
patent: 6841737 (2005-01-01), Komatsubara et al.
patent: 6943302 (2005-09-01), Kageyama et al.
patent: 6963084 (2005-11-01), Arao et al.
patent: 6995954 (2006-02-01), Coon
patent: 7084493 (2006-08-01), Funada et al.
patent: 7115673 (2006-10-01), Mochizuki et al.
patent: 7247529 (2007-07-01), Shoji et al.
patent: 7329817 (2008-02-01), Aonuma et al.
patent: 7336446 (2008-02-01), Kanagawa et al.
patent: 7371625 (2008-05-01), Yamazaki et al.
patent: 7372669 (2008-05-01), Deguchi et al.
patent: 2001/0005298 (2001-06-01), Hiraoka
patent: 2001/0028536 (2001-10-01), Sugimoto et al.
patent: 2003/0089520 (2003-05-01), Ooyabu et al.
patent: 2004/0058148 (2004-03-01), Ito et al.
patent: 2004/0221447 (2004-11-01), Ishii et al.
patent: 2004/0246626 (2004-12-01), Wakaki et al.
patent: 2004/0259326 (2004-12-01), Hideo
patent: 2005/0058445 (2005-03-01), Kaneiwa et al.
patent: 2005/0117257 (2005-06-01), Thaveeprungsriporn et al.
patent: 2005/0158665 (2005-07-01), Maekawa et al.
patent: 2005/0248885 (2005-11-01), Funada et al.
patent: 2006/0040435 (2006-02-01), Morisue et al.
patent: 2006/0087011 (2006-04-01), Kanagawa et al.
patent: 2006/0139809 (2006-06-01), Matsumoto et al.
patent: 2006/0159898 (2006-07-01), Uchiyama et al.
patent: 2006/0187587 (2006-08-01), Arai et al.
patent: 2006/0193084 (2006-08-01), Satoh et al.
patent: 2006/0202357 (2006-09-01), Kanagawa et al.
patent: 2006/0209462 (2006-09-01), Kajitani et al.
patent: 2006/0238921 (2006-10-01), Matsumoto et al.
patent: 2006/0244063 (2006-11-01), Isobe et al.
patent: 2006/0269730 (2006-11-01), Ishii et al.
patent: 2007/0019331 (2007-01-01), Kido et al.
patent: 2007/0269021 (2007-11-01), Yamaguchi et al.
patent: 2007/0279805 (2007-12-01), Komura et al.
patent: 2007/0279807 (2007-12-01), Kobayashi et al.
patent: 2008/0038517 (2008-02-01), Nishihata et al.
patent: 2003-152383 (2003-05-01), None
patent: 2004-035825 (2004-02-01), None
patent: 2004-335700 (2004-11-01), None
patent: 2006-120863 (2005-05-01), None
patent: 2006-93228 (2006-04-01), None
patent: 2006-134421 (2006-05-01), None
Ishii Jun
Ooyabu Yasunari
Thaveeprungsriporn Visit
Akerman & Senterfitt
Chen Xiaoliang
Dinh Tuan T
Edwards, Esq. Jean C.
Nitto Denko Corporation
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