Wired circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C360S245900

Reexamination Certificate

active

07465884

ABSTRACT:
The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.

REFERENCES:
patent: 6316734 (2001-11-01), Yang
patent: 6459043 (2002-10-01), Dodsworth
patent: 2002/0139569 (2002-10-01), Dodsworth
patent: 2003/0151902 (2003-08-01), Kageyama et al.
patent: 2004/0221447 (2004-11-01), Ishii et al.
patent: 2005/0117257 (2005-06-01), Thaveeprungsriporn et al.
patent: 2006/0187587 (2006-08-01), Arai et al.
patent: 2006/0269730 (2006-11-01), Ishii et al.
patent: 04-199790 (1992-07-01), None
patent: 2004-035825 (2004-02-01), None
patent: 2004-158480 (2004-06-01), None
patent: 2004-335700 (2004-11-01), None
patent: 2006-093228 (2006-04-01), None
patent: 2006-332549 (2006-12-01), None

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