Wired circuit board

Details Wired circuit board Wired circuit board

2008-04-08

2008-04-08

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S767000

Reexamination Certificate

active

07355128

ABSTRACT:
A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

REFERENCES:
patent: 5311404 (1994-05-01), Trask et al.
patent: 6108212 (2000-08-01), Lach et al.
patent: 6198052 (2001-03-01), Omote et al.
patent: 6239983 (2001-05-01), Shingai et al.
patent: 6395993 (2002-05-01), Nakamura et al.
patent: 6809415 (2004-10-01), Tsukada et al.
patent: 7098407 (2006-08-01), Kim et al.
patent: 2002-185133 (2002-06-01), None
patent: 2004-179341 (2004-06-01), None

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