Wirebondless module package

Details Wirebondless module package Wirebondless module package

1995-06-05

1997-04-01

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, 257700, 257729, H01L 2302

Patent

active

056168861

ABSTRACT:
A wirebondless module package and method of fabrication including a molded preform of porous SiC with a cavity having therein an AlN substrate defining a plurality of pockets. The preform being infiltrated with Al and the Al being deposited in each of the pockets. A semiconductor die mounted on the Al in one of the pockets. A dielectric layer covering the Al and defining openings therethrough positioned to expose the aluminum and a connection to the die. A conductive material positioned on the dielectric layer in contact with the die and the Al so as to define terminals and interconnections between the die and the terminals.

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