Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2003-11-17
2009-08-25
Ward, Jessica L (Department: 4111)
Metal fusion bonding
Process
Plural joints
C228S004500, C228S044700, C228S213000, C269S042000, C269S063000, C269S056000, C438S617000, C198S736000
Reexamination Certificate
active
07578425
ABSTRACT:
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
REFERENCES:
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 6062459 (2000-05-01), Sabyeying
Bakker Arjan Franklin
De Vet Arnoldus Jacobus Cornelis Bernardus
Kampschreur Thomas Markus
Stokkermans Joep
Van Der Meer Piet
NXP B.V.
Saad Erin B
Ward Jessica L
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