Wirebonder to bond an IC chip to a substrate

Details Wirebonder to bond an IC chip to a substrate Wirebonder to bond an IC chip to a substrate

2006-12-26

2006-12-26

Arbes, Carl J. (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S832000, C438S015000

Reexamination Certificate

active

07152308

ABSTRACT:
Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

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patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 3960279 (1976-06-01), Hartleroad et al.
patent: 5118300 (1992-06-01), Zarreii

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