Wirebonded device packages for semiconductor devices having...

Details Wirebonded device packages for semiconductor devices having... Wirebonded device packages for semiconductor devices having...

2008-05-20

2008-05-20

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S720000, C257S731000

Reexamination Certificate

active

11416037

ABSTRACT:
A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel to the elongated length of the electrode. A terminal lead may be integral with the conductive pad. A plurality of wirebonds of about the same length may electrically connect the conductive pad and the elongated electrode of the semiconductor device. As another alternative, a second semiconductor device may be mounted to the conductive pad and a plurality of wirebonds may electrically connect this second device and the elongated electrode of the first semiconductor device.

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