Wirebond structure and method to connect to a...

Details Wirebond structure and method to connect to a... Wirebond structure and method to connect to a...

2008-05-27

2010-12-21

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S110000, C438S119000, C438S612000, C438S617000, C257SE21499, C257SE21509, C257SE21519, C257SE21567

Reexamination Certificate

active

07855103

ABSTRACT:
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.

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Definition of the term “several” from Merriam-Webster OnLine dictionary. http://www.merriam-webster.com/dictionary/several. Retrieved by Examiner on Jun. 16, 2009.

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