Wirebond structure and method to connect to a...

Details Wirebond structure and method to connect to a... Wirebond structure and method to connect to a...

2005-08-02

2005-08-02

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000

Reexamination Certificate

active

06924554

ABSTRACT:
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.

REFERENCES:
patent: 5172212 (1992-12-01), Baba
patent: 6144100 (2000-11-01), Shen et al.
patent: 6218732 (2001-04-01), Russell et al.
patent: 6329722 (2001-12-01), Shih et al.
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6362531 (2002-03-01), Stamper et al.
patent: 6373137 (2002-04-01), McTeer
patent: 6417088 (2002-07-01), Ho et al.
patent: 6544880 (2003-04-01), Akram
patent: 6613671 (2003-09-01), Chopra et al.
patent: 6683383 (2004-01-01), Gleixner et al.
patent: 2002/0100794 (2002-08-01), Ho et al.
patent: 1139413 (2001-10-01), None
patent: 1146552 (2001-10-01), None

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