Wirebond pad for semiconductor chip or wafer

Details Wirebond pad for semiconductor chip or wafer Wirebond pad for semiconductor chip or wafer

2007-05-31

2009-06-30

Lewis, Monica (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000, C257S784000

Reexamination Certificate

active

07554208

ABSTRACT:
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.

REFERENCES:
patent: 6383916 (2002-05-01), Lin
patent: 6878633 (2005-04-01), Raskin et al.
patent: 2005/0017361 (2005-01-01), Lin et al.

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