Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2004-03-09
2008-12-30
Lewis, Monica (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S780000, C257S784000
Reexamination Certificate
active
07470997
ABSTRACT:
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
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Chen Michael
Chou Chien Kang
Chou Mark
Lin Mou-Shiung
Ackerman Stephen B.
Lewis Monica
Megica Corporation
Pike Rosemary L. S.
Saile Ackerman LLC
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