Wire-wound component to be mounted on a printed circuit board

Details Wire-wound component to be mounted on a printed circuit board Wire-wound component to be mounted on a printed circuit board

1997-01-21

2000-01-25

Kozma, Thomas J.

Inductor devices

With mounting or supporting means

174267, 336192, 361773, H01F 2706, H01F 2729

Patent

active

060182857

ABSTRACT:
A wire-wound component to be mounted on a printed circuit board. The wire-wound component is formed by winding a wire on the body of the wire-wound component and by winding both end portions of the wire on terminals. The terminals and the body of the wire-wound component are formed as one unit by molding same from a heat-resistant resin material. The molded terminals, on which both end portions of the wire are wound, are inserted into the printed circuit board, and then connected to a circuit pattern on the printed circuit board by soldering.

REFERENCES:
patent: 4484170 (1984-11-01), Wirth et al.
patent: 4803454 (1989-02-01), Umezaki
patent: 5055971 (1991-10-01), Fudala et al.
patent: 5309130 (1994-05-01), Lint
patent: 5351167 (1994-09-01), Wai et al.
AT&T Technologies, "Improved Coil Bobbin" Technical Digest No. 76, Mar. 1985, Dickens et al, pp. 19 & 20, 336-192.

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